Intel
INTCIntel's Semiconductor Story Runs Through Foreign-Labor Filings
Intel's policy story is chips, factories, and national capacity. Its filing story follows Intel Corporation and Intel employer-name variants.
Across FY2020 through FY2025, those rows add up to 23,646 Labor Condition Applications. Including the FY2026 partial-year rows, the total reaches 23,885. FY2025 alone accounts for 2,827 LCA filings.
The USCIS series shown here totals 10,333 approvals across the available approval rows. Where FY2025 rows are initial approvals only, the page labels them that way. LCA filings are not headcount, hired workers, or proof that a specific American worker was replaced.
17 total denials across all years (0.1% of filings) - too small to display on this chart.
The Intel Boundary Is Mostly Direct
Intel Corporation supplies the bulk of the rows, with Intel affiliate names rounding out a semiconductor labor footprint.
The peak year in the full-year series is FY2021, with 6,094 filings. FY2026 currently shows 239 rows and should be read as a partial-year value, not as a final decline.
This site no longer charts H-1B filings as a share of workforce. The ratio can blur U.S. employees, global employees, contractors, and offshore delivery headcount into one denominator.
Rows with a disclosed U.S.-employee denominator available here: 0. The analysis now uses filings, approvals, wage, worksite, and title concentration instead.
Cost Cuts Sit Beside a Technical Pipeline
Reuters/Bloomberg-linked reporting covered Intel workforce reductions and cost-cutting plans. That is labor context for a chipmaker with thousands of technical filings.
Intel's layoff and cost-cutting reports matter because the same company is asking the labor market for thousands of technical roles through LCA filings.
Intel's layoff reports do not prove that LCA filings replaced specific U.S. employees.
Chip Work Is Specialized, but Still Labor Market Power
The leading occupation is Electronics Engineers, Except Computer; the leading title is Component Design Engineer. Specialized work does not remove the need to scrutinize volume and wages.
For FY2025, the average H-1B wage in the filtered salary extract is $130,676, compared with an average prevailing-wage benchmark of $127,237. That is a $3,439 spread over the legal wage floor.
Hillsboro Is the Center of the Map
Hillsboro, or leads the worksite table with 8,949 rows, followed by the major Intel engineering and fabrication markets.
Intel's Long-Term Sponsorship Layer Is Large
Intel shows 7,536 PERM labor-certification cases from FY2020 through FY2025, including 1,060 in FY2025.
PERM records are a different process from H-1B petitions, but they matter because the sponsorship timeline can tie a worker to an employer for years.
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| Title | Count |
|---|---|
| Component Design Engineer | 5,818 |
| Software Engineer | 4,720 |
| Process Engineer | 4,285 |
| Product Engineer | 888 |
| Graphics Hardware Engineer | 811 |
| Packaging Engineer | 775 |
| Engineering Manager | 676 |
| Analog Engineer | 635 |
| System Validation Engineer | 611 |
| Research Scientist | 377 |
- LCA filings and salary data: DOL OFLC disclosure rows mapped by the employer-name boundary used for this investigation.
- H-1B approvals: USCIS H-1B Employer Data Hub CSV rows for FY2020-FY2023, plus FY2025 hub initial approvals where available.
- PERM data: DOL OFLC PERM disclosure rows mapped with the same employer-name boundary.
- Intel layoff and cost-reduction reporting, 2024-2025.
- BLS wage comparison: OEWS May 2023 national median for software developers.
Caveat: LCA filings are not H-1B petitions or hired workers. FY2025 USCIS hub rows are initial approvals only, so denial rates are not computed for those rows.